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1

Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method

Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.76 MB

english, 2008

2

Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint

Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.09 MB

english, 2008

3

Effect of plasma treatment on adhesion characteristics at interfaces between underfill and substrate

Bo-In Noh, Chang-Sung Seok, Won-Chul Moon, Seung-Boo Jung

Journal:

International Journal of Adhesion and Adhesives

Year:

2007

Language:

english

File:

PDF, 723 KB

english, 2007

4

Reliability of Au bump flip chip packages with adhesive materials using four-point bending test

Bo-In Noh, Jeong-Won Yoon, Jong-Woong Kim, Jong-Bum Lee, Noh-Chang Park, Won-Sik Hong, Seung-Boo Jung

Journal:

International Journal of Adhesion and Adhesives

Year:

2009

Language:

english

File:

PDF, 449 KB

english, 2009

5

Effect of surface finish material on printed circuit board for electrochemical migration

Bo-In Noh, Jong-Bum Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 913 KB

english, 2008

6

Fabrication and adhesion strength of Cu/Ni–Cr/polyimide films for flexible printed circuits

Bo-In Noh, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 523 KB

english, 2011

7

Caffeic acid phenethyl ester, a component of beehive propolis, is a novel selective estrogen receptor modulator

Bo-in Jung, Min-su Kim, Hyun-Ae Kim, Dasom Kim, Jiwon Yang, Song Her, Yun Seon Song

Journal:

Phytotherapy Research

Year:

2010

Language:

english

File:

PDF, 274 KB

english, 2010

8

Electrical properties and interfacial reaction of BGA package with underfill

Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2008

Language:

english

File:

PDF, 289 KB

english, 2008

9

Effect of underfill on bending fatigue behavior of chip scale package

Bo-In Noh, Noh-Chang Park, Won-Sik Hong, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2008

Language:

english

File:

PDF, 334 KB

english, 2008

10

Characteristics of environmental factor for electrochemical migration on printed circuit board

Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2008

Language:

english

File:

PDF, 409 KB

english, 2008

11

Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness

Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2009

Language:

english

File:

PDF, 478 KB

english, 2009

12

Interfacial reaction between Au–Sn solder and Au/Ni-metallized Kovar

Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2011

Language:

english

File:

PDF, 784 KB

english, 2011

13

Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu

Jeong-Won Yoon, Bo-In Noh, Jung-Hyun Choi, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2011

Language:

english

File:

PDF, 728 KB

english, 2011

14

Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni–Cr)/PI interfaces in flexible printed circuits

Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2011

Language:

english

File:

PDF, 675 KB

english, 2011

15

Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders

Jeong-Won Yoon, Jong-Gun Lee, Jong-Bum Lee, Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2012

Language:

english

File:

PDF, 706 KB

english, 2012

16

Microstructure, Electrical Properties, and Electrochemical Migration of a Directly Printed Ag Pattern

Bo-In Noh, Jeong-Won Yoon, Kwang-Seok Kim, Young-Chul Lee, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 913 KB

english, 2011

17

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 619 KB

english, 2011

18

Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints

Jeong-Won Yoon, Bo-In Noh, Bong-Kyun Kim, Chang-Chae Shur, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2009

Language:

english

File:

PDF, 1.71 MB

english, 2009

19

Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions

Yoon, Jeong-Won, Noh, Bo-In, Jung, Seung-Boo

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 4.39 MB

english, 2014

20

Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test

Yoon, Jeong-Won, Ko, Min-Kwan, Noh, Bo-In, Jung, Seung-Boo

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 3.11 MB

english, 2013

21

Effects of Underfill Materials and Thermal Cycling on Mechanical Reliability of Chip Scale Package

Bo-In Noh,, Jeong-Won Yoon,, Seung-Boo Jung,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2009

Language:

english

File:

PDF, 1.38 MB

english, 2009

22

Comparison of Interfacial Stability of Pb-Free Solders (Sn—3.5Ag, Sn—3.5Ag—0.7Cu, and Sn—0.7Cu) on ENIG-Plated Cu During Aging

Jeong-Won Yoon,, Bo-In Noh,, Seung-Boo Jung,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 1.01 MB

english, 2010

23

Mechanical Reliability of Sn-Ag BGA Solder Joints With Various Electroless Ni-P and Ni-B Plating Layers

Jeong-Won Yoon,, Bo-In Noh,, Seung-Boo Jung,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 1.09 MB

english, 2010

24

Evaluation of Thermal and Hygro-Thermal Behaviors of Flip Chip Packages With a Non-conductive Paste

Noh, Bo-In, Lee, Jong-Bum, Kim, Jong-Woong, Jung, Seung-Boo

Journal:

Journal of Adhesion Science and Technology

Year:

2008

Language:

english

File:

PDF, 2.89 MB

english, 2008

25

ChemInform Abstract: New Estrogenic Compounds Isolated from Broussonetia kazinoki.

Da Yeon Lee, Do Hee Kim, Hwa Jin Lee, YoungJoo Lee, Kwang Hee Ryu, Bo-In Jung, Yun Seon Song, Jae-Ha Ryu

Journal:

Year:

2010

Language:

english

File:

PDF, 20 KB

english, 2010

26

Thermal degradation of anisotropic conductive film joints under temperature fluctuation

Jong-Woong Kim, Ja-Myeong Koo, Chang-Yong Lee, Bo-In Noh, Jeong-Won Yoon, Dae-Gon Kim, Sun-Kyu Park, Seung-Boo Jung

Journal:

International Journal of Adhesion and Adhesives

Year:

2008

Language:

english

File:

PDF, 1000 KB

english, 2008

27

Effect of laminating parameters on the adhesion property of flexible copper clad laminate with adhesive layer

Bo-In Noh, Jeong-Won Yoon, Seung-Boo Jung

Journal:

International Journal of Adhesion and Adhesives

Year:

2010

Language:

english

File:

PDF, 510 KB

english, 2010

28

Thermal fatigue performance of Sn–Ag–Cu chip-scale package with underfill

Bo-In Noh, Bo-Young Lee, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Year:

2008

Language:

english

File:

PDF, 913 KB

english, 2008

29

New estrogenic compounds isolated from Broussonetia kazinoki

Da Yeon Lee, Do Hee Kim, Hwa Jin Lee, YoungJoo Lee, Kwang Hee Ryu, Bo-In Jung, Yun Seon Song, Jae-Ha Ryu

Journal:

Bioorganic & Medicinal Chemistry Letters

Year:

2010

Language:

english

File:

PDF, 303 KB

english, 2010

30

Effect of thermal treatment on adhesion strength of Cu/Ni–Cr/polyimide flexible copper clad laminate fabricated by roll-to-roll process

Bo-In Noh, Jeong-Won Yoon, Jung-Hyun Choi, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 1.21 MB

english, 2011

31

Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages

Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Dae-Gon Kim, Bo-In Noh, Jong-Woong Kim, Jung-Hoon Moon, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Year:

2008

Language:

english

File:

PDF, 660 KB

english, 2008

32

Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate

Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 443 KB

english, 2009

33

Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes

Bo-In Noh, Jeong-Won Yoon, Won-Sik Hong, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 495 KB

english, 2009

34

Effects of Different Kinds of Underfills and Temperature–Humidity Treatments on Drop Reliability of Board-Level Packages

Bo-In Noh, Jeong-Won Yoon, Sang-Ok Ha, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 660 KB

english, 2011

35

Effect of Ni-Cr seed layer thickness on the adhesion characteristics of flexible copper clad laminates fabricated using a roll-to-roll process

Bo-In Noh, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Metals and Materials International

Year:

2010

Language:

english

File:

PDF, 1.45 MB

english, 2010

36

Oxidative stress increases phosphorylation of IκB kinase-α by enhancing NF-κB-inducing kinase after transient focal cerebral ischemia

Song, Yun Seon, Kim, Min-Soo, Kim, Hyun-Ae, Jung, Bo-In, Yang, Jiwon, Narasimhan, Purnima, Kim, Gab Seok, Jung, Joo Eun, Park, Eun-Hee, Chan, Pak H

Journal:

Journal of Cerebral Blood Flow and Metabolism

Year:

2010

Language:

english

File:

PDF, 680 KB

english, 2010

37

Electrochemical Migration Characteristics of Screen-Printed Silver Patterns on FR-4 Substrate

Kim, Kwang-Seok, Ahn, Jee-Hyuk, Noh, Bo-In, Jung, Seung-Boo

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2012

Language:

english

File:

PDF, 1.33 MB

english, 2012

38

Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints

Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Ja-Myeong Koo, Dong-Woon Park, Myung-Wan Ko, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2008

Language:

english

File:

PDF, 2.84 MB

english, 2008

39

Effect of boron content in electroless Ni–B layer on plating layer properties and soldering characteristics with Sn–Ag solder

Jeong-Won Yoon, Ja-Myeong Koo, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Chang-Yong Lee, Jong-Hyun Park, Chang-Chae Shur, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2008

Language:

english

File:

PDF, 1.50 MB

english, 2008

40

Effects of cerium content on wettability, microstructure and mechanical properties of Sn–Ag–Ce solder alloys

Bo-In Noh, Jung-Hyun Choi, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2010

Language:

english

File:

PDF, 1.62 MB

english, 2010

41

Effects of third element and surface finish on interfacial reactions of Sn–Ag–xCu (or Ni)/(Cu or ENIG) solder joints

Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2010

Language:

english

File:

PDF, 837 KB

english, 2010

42

Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process

Jeong-Won Yoon, Bo-In Noh, Jae-Hyun Yoon, Han-Byul Kang, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Year:

2011

Language:

english

File:

PDF, 1.31 MB

english, 2011

43

Long-distance esophagogastric submucosal dissection after minimal esophageal trauma of a gastric tube

Min-Kuk Kim, Byung-Wook Kim, Jeong-Won Jang, Jung-Hyun Choi, Hyun-Jung Jung, Jeong-Seon Ji, Hwang Choi, Bo-In Lee, Hiun-Suk Chae, Kyu-Yong Choi, In-Sik Chung

Journal:

Gastrointestinal Endoscopy

Year:

2008

Language:

english

File:

PDF, 691 KB

english, 2008

44

Preoperative Placement of Self-Expandable Metallic Stent for Obstructive Colorectal Cancers: Factors Influencing Clinical Success

Bo-in Lee, Kang-Moon Lee, Jung Hwan Oh, Dae Yeong Cheung, Hyeon Seong Kim, Jeong-Seon Ji, Byung Wook Kim, Hwang Choi, Chang Nyol Paik, Woo Chul Chung, Jeongjo Jeong, Kyu-Yong Choi

Journal:

Gastrointestinal Endoscopy

Year:

2009

Language:

english

File:

PDF, 48 KB

english, 2009

45

Endoscopic removal of a migrated esophageal self-expandable metal stent after compression with detachable snares through an intact esophageal stent

Ho-Jung An, Hae-Yon Lee, Byung-Wook Kim, Sun-Mee Park, Jeong-Seon Ji, Bo-In Lee, Hwang Choi, Hiun-Suk Chae, Kyu-Yong Choi, In-Sik Chung

Journal:

Gastrointestinal Endoscopy

Year:

2010

Language:

english

File:

PDF, 651 KB

english, 2010

46

Sa1583 Diagnostic Accuracy and Inter-Observer Agreement in Predicting Submucosal Invasion of Early Colorectal Cancer-Looking Lesions by Gross Findings, Pit Patterns, and Microvasculatures

Hye Jung Choi, Bo-in Lee, Hwang Choi, Kyu-Yong Choi, Sang Woo Kim, Joo Yong Song, Jeong-Seon Ji, Byung Wook Kim

Journal:

Gastrointestinal Endoscopy

Year:

2011

Language:

english

File:

PDF, 89 KB

english, 2011

47

Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder

Bo-In Noh, Jeong-Won Yoon, Kwang-Seok Kim, Sayoon Kang, Seung-Boo Jung

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.51 MB

english, 2013

48

Effect of rare earth metal Ce addition to Sn-Ag solder on interfacial reactions with Cu substrate

Yoon, Jeong-Won, Noh, Bo-In, Jung, Seung-Boo

Journal:

Metals and Materials International

Year:

2014

Language:

english

File:

PDF, 896 KB

english, 2014

49

Mo1112 Clinical Significance of Fecal Leukocyte, Lactoferrin, and Calprotectin in Moderate to Severe Acute Diarrhea

Lee, Hae Mi, Lee, Bo-In, Lee, Seungok, Song, Joo Yong, Choi, Hye jung, Kang, Bong Koo, Im, Eun Joo, Kim, Joon Sung, Kim, Jong In, Kim, Byung Wook, Choi, Hwang

Journal:

Gastroenterology

Year:

2012

Language:

english

File:

PDF, 72 KB

english, 2012

50

M1186 A Polymorphism of CD14 Is Associated with Inflammatory Bowel Disease in Korean Population

Lee, Kang-Moon, Chung, Woo Chul, Paik, Chang Nyol, Lee, Bo-In, Lee, Jeong Rok, Jung, Sung Hoon, Lee, Min Kyoung, Choi, Kyu Yong

Journal:

Gastroenterology

Year:

2009

Language:

english

File:

PDF, 44 KB

english, 2009

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